The Summit LXi workbench is the only system fully designed for repairing large circuit boards.

Summit LXi is equipped with an X-Y workbench and circuit board support platform, which can accommodate PCBs of 24 "x 36" (610mm x 915mm) size. At the same time, an 8kW convective high-pressure bottom heater can provide maximum heat transfer. The increased top and bottom clearances are 2.75 "(70mm) and 2.0" (51mm) respectively. In addition, an optical system with an 80mm square field of view can help you easily repair large components.

This system has all the renowned SRT performance, including advanced automatic temperature curve setting, programmable pickup and placement force with component height sensing, independent top heater and pickup tube, proprietary split image and precise placement performance, optical/digital zoom, and automatic data/event recording.

The strengthened Summit LXi control system is not affected by facility changes and supports more precise calibration, allowing for the sharing of process parameters between systems at multiple locations.

The system can be equipped with various functions, including a three-level bottom heater, automatic tin removal, and a high-power 10kW bottom heater, which can be used to handle the most difficult applications.

Can accommodate substrate size 24 "X36" (612mmx914mm)

(650mm x 1200mm) optional

Top heating power Kw, switchable power hot air focused convection

Bottom heating power 8Kw, hot air focused convection

10Kw hot air focused convection (optional)

Field of view 80 X 80 mm

120 X 120 mm optional

Repairable component size 2X2mm to 120X120mm

6 Thermocouples can be connected to thermoelectric even numbers

14 Thermocouples optional

All types of BGA component repairs

Repair of oversized PCB (650X1200mm)

Repair of through-hole components

Automatic tin removal system (optional)